Single Sided Flex PCB 1Layer Raised Point | YSPCB

Short Description:

Parameters

Layers:1
Base Material:SF230 ，0.5OZ，0.12MM finished
Minimum Line Width/Clearance：0.45mm/0.45mm
Size：76mm×64mm
Surface treatment：ENIG

Crafts

Special Process：Raised Point

Applications

Medical Instrument
Urgent model after 24-48 hours / normally after 2-3 days shipping

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Product Detail

When circuits are too complex for single layer wiring or copper foil is needed for grounding shielding, double-layer or even multilayer boards are needed. The most typical difference between a laminate and a monolayer is the addition of a through-hole structure to connect the layers of copper foil. General substrate + transparent adhesive + copper foil the first processing process is the production of holes. First in the substrate and copper foil drilling, cleaning and plating a certain thickness of copper, and then through the hole is finished. And the next process is almost identical to that of a single board.