Bendable PCB 1Layer camera module | YSPCB
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ITEM | Parameters |
Base Materials | Polyimide or Polyester |
Cover-lay | Polyimide, ,Polyester or Solder Mask |
Thickness | 0.5mil, 1mil, 2mil |
Line Width/Space | Normal Min. 0.075/0.075mm, Special Min. 0.040/0.040mm |
Conductor | 1/3oz(12§)，0.5oz(18§), 1oz(35§), ED or RA Copper |
Min. through hole diameter | Bit Drill Via Normal Min. ￥O 0.200mm, Special |
Finish Plating | Electroless Nickel, Immersion Gold, Direct Gold, Soft Gold, Hard Gold, Organic Solderability Preservative, Immersion Tin |
Stiffener | Stiffener PI, G/Epoxy, CEM3 |
Double Coated tape | Double Coated tape 3M 467,966, Sony D3430, T4100 ect |
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